UPN-TWLN150-A12-0864-AIKT1

Name: UPS Pro TWL AI Dev Kit [Hailo 8L: 13TOPS]

SKU: UPN-TWLN150-A12-0864-AIKT1

Processor: Intel® Processor N150

Mainboard: UPS Pro TWL

Graphics: Intel® UHD Graphics

VPU: Hailo-8L™ M.2 2230 AI Module w/ heatsink [13 TOPS]

Pre-Installed Module: via M.2 2230-Hailo 8L

Memory: 8GB

eMMC / Storage: 64 GB

FPGA: Lattice

BIOS: UEFI

RTC: Yes

Wake-on-LAN (WoL): Yes

Watchdog Timer: Yes

PXE: Yes

TPM: TPM2.0 on board

Pre-Installed OS: Ubuntu 24.04 LTS

Compatible OS: Windows 11 LTSC

Compatible OS: Ubuntu 22.04/kernel 6.11+

Compatible OS: ubuntu 24.04/kernel 6.11+

Compatible OS: Yocto 5+

Dimension: 101.6 mm × 101.6 mm

HDMI: 1 x HDMI 2.0b

Display Port: 1 x DP 1.2

Display Port: 1 x DP 1.4a via USB Type C

USB: 2 x USB 2.0 via 10-pin wafer

USB: 2 x USB 3.2 Gen 2 Type A

USB: 1 x USB 3.2 Type C

Audio: 1x Audio Jack (Mic-in, Line out)

UART: 1x UART via 10pin wafer

Serial Port: 2 x RS-232/422/485 10-pin header

Expansion Slot: 1 x M.2 2280 M key (PCIe Gen 3 x2, USB2.0)

Expansion Slot: 1 x M.2 2230 E key (CNVI , PCIe Gen 3 x1, USB2.0) taken by Hailo-8L™ M.2 2230 AI Module

Expansion Slot: 1 x M.2 3052 B Key (USB3.2 Gen 2 only) with Nano SIM slot

GPIO: Yes

MIPI-CSI: Yes

Ethernet: 2 x 2.5GbE (Intel® i226IT)

Wi-Fi: optional ( via. M.2 2230 ) taken by Hailo-8L™ M.2 2230 Module

Bluetooth: optional ( via. M.2 2230 ) taken by Hailo-8L™ M.2 2230 Module

LTE / 4G / 5G: optional ( via. M.2 3052 )

Power Requirement: 12V DC-in

Power Supply Type: AT/ATX mode

Power Consumption (Typical): 26W~35W

Cooling: Active heatsink

Operating Temperature: 32°F ~ 140°F (0°C ~ 60°C)

Storage temperature: -40°F ~ 176°F (-40°C ~ 80°C)

Certification: CE/FCC Class A, RoHS Compliant, REACH

Net Weight: 750gm

Gross Weight: 1200gm

HS Code: 8473302000

Country of Origin: Taiwan

Accessories: 1x Hailo-8L™ M.2 2230 Module w/ heatsink

Accessories: 1x UP HD Camera

Accessories: 1x 12V/6A Power Adapter

UPN-TWLN150-A12-0864-AIKT2

Name: UPS Pro TWL AI Dev Kit [Deep X: 25TOPS]

SKU: UPN-TWLN150-A12-0864-AIKT2

Processor: Intel® Processor N150

Mainboard: UPS Pro TWL

Graphics: Intel® UHD Graphics

VPU: DEEPX.DX-M1 M.2 2280 AI Module w/ heatsink [25 TOPS]

Pre-Installed Module: via M.2 2280-Deep X M1

Memory: 8GB

eMMC / Storage: 64 GB

FPGA: Lattice

BIOS: UEFI

RTC: Yes

Wake-on-LAN (WoL): Yes

Watchdog Timer: Yes

PXE: Yes

TPM: TPM2.0 on board

Pre-Installed OS: Ubuntu 24.04 LTS

Compatible OS: Windows 11 LTSC

Compatible OS: Ubuntu 22.04/kernel 6.11+

Compatible OS: ubuntu 24.04/kernel 6.11+

Compatible OS: Yocto 5+

Dimension: 101.6 mm × 101.6 mm

HDMI: 1 x HDMI 2.0b

Display Port: 1 x DP 1.2

Display Port: 1 x DP 1.4a via USB Type C

USB: 2 x USB 2.0 via 10-pin wafer

USB: 2 x USB 3.2 Gen 2 Type A

USB: 1 x USB 3.2 Type C

Audio: 1x Audio Jack (Mic-in, Line out)

UART: 1x UART via 10pin wafer

Serial Port: 2 x RS-232/422/485 10-pin header

Expansion Slot: 1 x M.2 2280 M key (PCIe Gen 3 x2, USB2.0) taken by DEEPX.DX-M1 M.2 2280 AI Module

Expansion Slot: 1 x M.2 2230 E key (CNVI , PCIe Gen 3 x1, USB2.0)

Expansion Slot: 1 x M.2 3052 B Key (USB3.2 Gen 2 only) with Nano SIM slot

GPIO: Yes

MIPI-CSI: Yes

Ethernet: 2 x 2.5GbE (Intel® i226IT)

Wi-Fi: optional ( via. M.2 2230)

Bluetooth: optional ( via. M.2 2230)

LTE / 4G / 5G: optional ( via. M.2 3052)

Power Requirement: 12V DC-in

Power Supply Type: AT/ATX mode

Power Consumption (Typical): 26W~35W

Cooling: Active heatsink

Operating Temperature: 32°F ~ 140°F (0°C ~ 60°C)

Storage temperature: -40°F ~ 176°F (-40°C ~ 80°C)

Certification: CE/FCC Class A, RoHS Compliant, REACH

Net Weight: 750 gm

Gross Weight: 1200 gm

HS Code: 8473302000

Country of Origin: Taiwan

Accessories: 1x DEEPX.DX-M1 M.2 2280 Module w/ heatsink

Accessories: 1x UP HD Camera

Accessories: 1x 12V/6A Power Adapter

Documentation:

• UP AI SW Dev Suite Tutorial
• UPS Pro TWL AI Dev Kit Datasheet

Package Includes:

• 1 x UP Squared Pro TWL AI Dev Kit Series [Up to 214 TOPs]