The STEVAL-STWINMAV1 microphone array expansion adds advanced audio sensing capabilities to the STEVAL-STWINKT1B (and STEVAL-STWINKT1) Sensor Tile Wireless Industrial Node (STWIN) kit for high frequency vibration monitoring applications.

The board includes four low-power, high signal-to-noise ratio (SNR) MP23ABS1 capacitive sensing microphones, supported by a very low drop voltage, low quiescent current and low-noise voltage regulator ideal for batter-powered applications such as STWIN.

The expansion board is connected via a dedicated 12-pin connector to the core system board, which runs the STSW-STWINKT01 firmware with dedicated BSP drivers and application examples for you to test and develop vibration monitoring in the ultrasound frequency ranges.

Features:

Analog microphone array expansion for STEVAL-STWINKT1B (and STEVAL-STWINKT1)
Connects to STWIN core system board through dedicated 12-pin connector
3 V to 5.5 V power supply input
4 mm square-shaped differential microphone array
4x MP23ABS1 high-performance, single-ended, analog, bottom-port MEMS microphones
LDK130 300 mA low quiescent current very low noise LDO
On-board audio-grade quad ADC
Serial Audio Interface (SAI) digital output

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