RAK3272-SiP Breakout Board is an evaluation board for the new RAK3172-SiP System in a Package LPWAN module. It makes it easy to evaluate the power of the RAK3172-SiP module with access to all pin's of the SIP module. All pins are accessible on 6 rows of Pin headers with a standard pitch of 2.54mm.

The RAK3172-SiP is a low-power long range transceiver system in a package (SiP) that is based on STM32WLE5 chip. It provides an easy to use, small size, low-power solution for long range wireless data applications. This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications. It can easily connect to different LoRaWAN server platforms like TheThingsNetwork (TTN), Chirpstack, Actility, etc. It also supports LoRa Point-to-Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly.

• You can configure the mode and operation of the module using AT commands via a UART interface. RAK3172 also offers low power features which is very suitable for battery-powered applications. It is RUI3 compatible which allows you to create custom firmware using RUI3 APIs.

Features:

• Based on RAK3172-SiP
• RUI3 API compatible
• LoRaWAN 1.0.3 specification compliant
• Supported bands: IN865, EU868, AU915, US915, KR920, RU864, and AS923
• LoRaWAN Activation by OTAA/ABP
• LoRa Point-to-Point (P2P) communication
• Easy to use AT Command Set via UART interface
• Long-range - up to 15 km with optimized antenna
• Ultra-Low Power Consumption of 1.69 μA in sleep mode
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range: -40° C ~ 85° C
• Module size: 25.4 x 32.3 mm
• Package Inclusion
• 1pcs RAK3272-SiP Breakout Board
• 1pcs 2dBi SubG Antenna(Antenna for LoRa®)
• 18pcs Dupont lines

Documentation:

• RAK3272-SiP Breakout Board Documentation 

Package Includes:

• 1 x RAK3272-SiP Breakout Board
• 1 x 2dBi SubG Antenna(Antenna for LoRa®)
• 18 x Dupont lines