These are high quality heat sink with conduction glue that can be used for dissipating the heat emitted by various memory, BGA & SoC's chips.

Specifications

Heat Sink - Aluminum with Glue

Dimensions

55) 14mm x 14mm x 5mm

56) 20mm x 20mm x 5mm

Qty

These high quality Heat sink can be used for dissipating the heat emitted by TO220 package device su..

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..

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