H1 V3 features HDPLEX minimalism design and high quality 15mm thick brushed aluminum faceplate.

H1 V3 utilize heavy duty mirror polished copper base and six 6mm diameter copper heatpipes for best heat transfer effeciency. Heatpipes are fully buried inside both aluminum side panels. This is a design with no comproise. H1.S supports CPU with 65W TDP Max.

H1 V3 CPU heatsink system supports latest latest LGA1700 13th Gen Intel CPU and LGA1200/1151 socket for Coffee Lake,Broadwell and Haswell LGA1150 socket, Ivy Bridge and Sandy Bridge LGA1155 socket, Legacy LGA775 socket, and APU with AM5 AM4 APU/AM2/AM3/FM1/FM2 socket.

The zigzagged aluminum top plate provides three times more heat dissipitation area.

H1 V3 supports mini-ITX motherboard. You could find the latest compatible motherboard list under Hardware Compatibility page.

H1 V3 supports Thin-ITX together with full height single slot PCIEx1 or PCIEx4 expansion card with optional H1 V3 Thin-ITX backplate. The H1 V3 Thin-ITX backplate is not included in H1 and is sold separately with HDPLEX NUC kit only. Flexible PCIEx1 or PCIEx4 riser card is also required for connecting expansion card.

H1 V3 supports max four SSD via two HDD rack.

H1 V3 supports HDPLEX 250W GaN AIO ATX PSU for fully internal PSU solution.

H1 V3 supports 200W DC-ATX or 400W HiFi DC-ATX + External AC Aadpter power supply combo solution.

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H1 V3 supports 200W DC-ATX or 400W HiFi DC-ATX + HDPLEX 300W Linear Power Supply Audio PC solution.

H1 V3 supports 7th Gen NUC board such as NUC7i3DN with dual HDMI I/O by working with HDPLEX Fanless NUC kit. The HDPLEX NUK Kit in H1 uses six heatpipe heatsink system and supports the 65W TDP which is the best passive NUC system on the current market.

H1 V3 with HDPLEX NUC Kit also supports 8th and 10th Gen NUC board with HDMI+USB 3.1 I/O such as NUC8ixBEB. With M.2-PCIE adapter card, H1.S V3 can support one PCIE expansion card for NUC system. This is the first NUC case in the market which supports PCIE expansion card.

HDPLEX NUC kit copper base supports both three-hole and four-hole NUC heatsink mounting patterns.

HDPLEX Fanless NUC kit includes two I/O plates which supports both dual HDMI I/O and single HDMI+USB 3.1 I/O layout. If there is popular NUC I/O layout released by Intel in the future, HDPLEX will release new I/O plate to support it.

H1 V3 Hardware Compatibility

• For HDPLEX H1 V3 Series, we recommend CPU with <=65W TDP. HDPLEX fanless chassis is best for CPU with integrated GPU via 32nm or more advanced manufacturing process. Intel latest LGA1700 13th Gen and LGA1200/1151 socket for Coffee Lake,BroadwellCoffee Lake,Kaby Lake,Skylake,Haswell,Sandy Bridge,Ivy Bridge and latest AMD Ryzen APU are highly recommended.
• H1 series is compatible with most Intel/AMD mini-ITX and thin-ITX motherboard. If you are not sure if your motherboard is compatible with HDPLEX case, you are welcomed to email larry at hdplex dot com and we will confirm it for you.
•  HDPLEX H1.S V3 series also supports 7th and 8th Gen NUC board with optional HDPLEX NUC kit.

Product Description:

• Material & Color
• Material: 6063T Aluminum Alloy
• Body Color: Black
• Body Finish: Durable Powder Coating
• Faceplate Color: Silver or Black
• Faceplate Finish: Brushed Aluminum
• Weight 8lbs(3.5kg)
• Dimension
• Internal 270x196x58mm (L x W x H)
• External 270x264x63.5mm (L x W x H)
• Faceplate 286x70x15mm(L x W x D)
• Power Supply Option
• HDPLEX 250W GaN AIO ATX PSU Supported
• HDPLEX 200W or 500W HiFi DC-ATX +External AC Adapter Supported
• HDPLEX 200W DC-ATX +HDPLEX 300W Linear Power Supply Supported
• HDPLEX 500W HiFi DC-ATX +HDPLEX 300W Linear Power Supply Supported
• Third Party DC-ATX/PicoPSU+External AC Adapter Supported
• Cooling System
• Intel LGA1700/1200/115x
• AMD AM5/AM4/AM2/AM3/FM1/FM2 Socket APU Supported
• Intel NUC Three-Hole and Four-Hole BGA Socket Supported (HDPLEX NUC Kit Required)
• HDPLEX H1 Series Six-Heatpipe CPU Heatsink System
• support 65W TDP CPU
• Compatibility
• Mini-ITX/Thin-ITX
• 7th/8th/10th NUC Supported (optional HDPLEX Fanless NUC Kit is required for NUC support)
• 4x2.5" SSD/HDD Supported
• USB 3.1 Side Port: One
• Packaging
• Double Packaged
• Dimension: 12"x12"x8"
• Shipping Weight: 4.5kg/ 9lbs

Package Includes:

• 1 x HDPLEX H1 V3 Fanless Computer Case Double Packaged.
• 1 x HDPLEX H1 Fanless CPU Heatsink System with 3.5g high quality thermal paste
• Accessories (Included in the H1.S V3 Package):
• Installation Screw Kit
• 2.5mm Tip M4 HEX Head Screw Driver
• Two SSD/2.5” HDD Rack for H1 V3 Series
• Internal USB 3.1 Type C to 20PIN Cable
• Power Button with 60cm Cable
• Power Adapter Plate for 7.4*5.0mm Self-Lock Connector